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Department of Military Affairs Tender by Indian Navy (GEM/2025/B/6125978)

DESOLDERING WICK 2.5MM,SMD TESTER TWEEZER TYPE MS8910,THROUGH HOLE DESOLDERING 1MM C560002,THROUGH

Goods
Qty:764
Department of Military Affairs Tender by Indian Navy (GEM/2025/B/6125978)

Tender Timeline

Tender Issue
April 11, 2025 at 3:30 PM

Tender Title: PROCUREMENT FOR ELECTRONIC COMPONENTS HANDLING AND SOLDERING ESSENTIALS
Tender Reference Number: GEM/2025/B/6125978
Issuing Authority/Department: Department of Military Affairs, Ministry of Defence

The objective of this tender is to procure essential electronic components handling and soldering tools. The selected contractor will be responsible for providing a diverse range of products, including but not limited to desoldering wicks, SMD tester tweezers, through-hole desoldering tools, suction filters, test probe kits, and various types of clips. The total quantity required is 764 units across multiple categories, ensuring a comprehensive supply chain for efficient operations in military electronic assembly and repair tasks.

Scope of Work and Objectives

The procurement involves several specific components, including:

  • Desoldering Wick (2.5mm)
  • SMD Tester Tweezers (Type MS8910)
  • Through-Hole Desoldering Tools (1mm, 1.3mm)
  • Suction Filters (821830)
  • Test Probe Kits (U1168A)
  • Various SOIC Clips and DIP Test Clips

The main objective is to ensure that all components meet high industry standards for quality and performance, enabling the military sector to maintain precision in electronic repairs and assembly tasks.

Eligibility Criteria

To be eligible for submission:

  • Bidders must be registered entities capable of supplying the specified components.
  • Bidders must comply with local content and procurement rules as per the Ministry of Defence guidelines.
  • Consistency with quality standards and certifications relevant to electronics handling and soldering will be assessed.

Technical Requirements

The tender specifies that all products must meet defined technical specifications, including the usage of compliant materials, durability under varied conditions, and compatibility with existing military equipment. Suppliers must demonstrate their adherence to quality standards with any applicable certifications.

Financial Requirements

Bidders must disclose their pricing structures in accordance with the requirements laid out in the bid documents. Payment terms and conditions should also be outlined, ensuring transparency and adherence to budget constraints within the military procurement framework.

Document Submission Details

Bidders must submit their proposals electronically, ensuring that all necessary documents, including technical specifications, price quotes, and compliance certificates, are included. Bids should be formatted in PDF unless otherwise specified.

Special Provisions

Micro, Small, and Medium Enterprises (MSEs) and Startups will be given preferential treatment under this tender. The provisions aim to promote local manufacturers and encourage innovation within the sector, aligning with initiatives such as 'Make in India'.

Evaluation Process

The proposed bids will undergo a detailed evaluation process based on the following criteria:

  • Compliance with technical specifications
  • Pricing assessments
  • Quality certifications Bidders will be notified of the selection outcomes as per the prescribed guidelines.

Delivery Locations

All supplies must be delivered to designated military installations ensuring secure and timely distributions.

Contact Information

For inquiries regarding the tender, interested parties should reach out to the procurement office of the Department of Military Affairs, Ministry of Defence. However, please note that explicit contact details are not provided in this description.

This tender represents a significant opportunity for vendors in the electronics and soldering sectors, particularly those committed to quality and compliance with military standards.


General Information

Item Category
DESOLDERING WICK 2.5MM , SMD TESTER TWEEZER TYPE MS8910 , THROUGH HOLE DESOLDERING 1MM C560002 , THROUGH HOLE DESOLDERING 1.3MM C560004 , SUCTION FILTER 821830 , TEST PROBE KIT U1168A , 8PIN SOIC CLIP MODEL 5250 , DISPOSABLE COLLECTION CHAMBER FOR MFR H5 DS PACK OF 100 MFR DC100 , 14 PIN SOIC CLIP MODEL 5251 , 16 PIN SOIC CLIP MODEL 5252 , 8 PIN DIP TEST CLIP , 14 PIN DIP TEST CLIP , 16 PIN DIP TEST CLIP , POMONA TEST LEAD , PROBE MINI BANANA TO MICRO BANANA CLIP , 0.25 SQMM SINGLE STRAND WIRE , JBC AIR SUCTION FILTER BOX CONTAINING 10 NOS 5966 , PLC IC PULLER 3X3 TW 368 , HOOK UP WIRE GAUGE 22AWG , INTERNAL GASKET FOR TIN DEPOSITOR 812360 , TWEEZER CARTRIDGE BLADE 1.27MM PTTC 702 , COTTON FILTER FOR DESOLDERING STATION JBC, 10N IN EACH PACK 781046 , THROUGH HOLE DESOLDERING 2.4MM C560007 , THROUGH HOLE DESOLDERING 0.8MM C560014 , THROUGH HOLE DESOLDERING 1MM C560003 , THROUGH HOLE DESOLDERING 1.3MM C560009 , NOZZLE JN2015 , NOZZLE JN2012 , NOZZLE JN2020 , CARTRIDGE BEVEL 1.78MM STTC 147P , CARTRIDGE CONICAL 0.4MM STTC 106 , CARTRIDGE CONICAL 0.5MM STTC 143 , CARTRIDGE HOOF 3.3MM 60DEG SMTC 1147 , CARTRIDGE CONICAL 1 MM STTC 101 , SOLDERING HAND PIECE MX H1 AV , DESOLDERING TIP 0.76MM DFP CN3 , TWEEZER CARTRIDGE BLADE 20.6MM PTTC 706 , TWEEZER CARTRIDGE BLADE 28MM PTTC 707 , SOLDERING TWEEZER HANDLE MX PTZ , VME EXTENDER BOARD AND CLAMPS , APLAB AUTO COMPUTE LCR Q METER 4910 , RJ45 CONNETOR , CMOS BATTERY CR2032 AND CR2035 , SOLDERING FLUX RMA 223 , SOLDER FLUX PEN CW8100 , SOLDERING HAND PIECE T245 A , HEATING ELEMENT DR560 A DSV DR , SOLDERING BIT DIA 5MM C245 766 , SOLDERING BIT DIA 2.4X0.5MM C245 759 , SOLDERING BIT DIA 1MM PTFE COATED TIP C245 119 , JBC TIN DEPOSITOR FILTER BOX 780840 , TEST LEAD SET TLK 100 , EPROM SOCKET ADAPTOR DX1036 , METCAL COIL ASSEMBLY OKI BY MFR 1300 , 03 PIN PLUG UNIVERSAL ADOPTOR , ANTISTATIC SAFETY WRIST BAND , DESOLDERING UNIT MX 5250 , SOLDERING HAND PIECE MX H2 UF , HEATER HOSE SET JT T2A , DESOLDERING IRON DR560 A , SUCTION TUBE 932330 , TRIPOD T2050 39mm T2250 85mm , SUCTION CUP SET 940163 , BENT NEEDLES SET 861660 , STRAIGHT NEEDLES SET 901546 , SOLDERING LEAD GAUGE 22SWG
Ministry Name
Organisation Name

Financial Information

Bid Offer Validity
180 (Days)
Arbitration Clause
No
Mediation Clause
No

Evaluation and Technical Information

Evaluation Method
Total value wise evaluation
Inspection Required
Yes
Technical Clarifications Time
3 Days

Tender Documents

4 Documents
GeM-Bidding-7724099.pdfMain Document
BOQ DocumentBOQ BOQ
BOQ DocumentBOQ BOQ
GEM General Terms and Conditions DocumentGEM_GENERAL_TERMS_AND_CONDITIONS

Frequently Asked Questions

The eligibility requirements include being a registered entity with the capacity to deliver the specified electronic components. Interested bidders must comply with local procurement rules and quality standards set forth by the Ministry of Defence. Consistency with military guidelines for electronic handling and soldering essentials is essential.

Bidders must provide any applicable certifications that verify adherence to industry quality standards for electronic components. Compliance documents should demonstrate technical specifications and validate product safety and efficiency standards relevant to electronics handling.

To participate, potential suppliers should ensure they possess a valid business registration and have relevant experience in supplying electronic components. Registration typically involves providing necessary compliance documents and may require submitting proof of previous contracts that verify the supplier’s capabilities.

Documents for submission must primarily be in PDF format, as it ensures maintainability of the original formatting. Other formats may be specified in the tender guidelines, but adherence to the required format is crucial for the proper evaluation of bids.

The payment terms will be detailed in the bid documents. Generally, payments will be contingent on the successful delivery and acceptance of the products, following a satisfactory evaluation of the supplied components. Bidders should also clarify any conditions regarding performance security or advance payments within their proposals.

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