IOT LAB KIT - Ministry of Micro Small and Medium Enterprises

PIC Microcontroller Kit,ARM AI Processor Kit,ARM AI Processor Kit,Raspberry Pi 5 16GB kit,Arduino B

Goods
Qty:37

Tender Timeline

Tender Issue
June 13, 2025 at 5:14 PM

Tender Description

Tender Title: IOT LAB KIT

Reference Number: 7bf048ff

Issuing Authority/Department: Ministry of Micro Small and Medium Enterprises

The IOT LAB KIT tender aims to procure various microcontroller kits and related components to facilitate the creation of a state-of-the-art Internet of Things (IoT) laboratory. This initiative is aligned with enhancing practical learning and technological innovation, targeting educational institutes, research bodies, and organizations focusing on IoT technology.

Scope of Work and Objectives

The primary objective is to supply PIC Microcontroller Kit, ARM AI Processor Kit, Raspberry Pi 5 16GB Kit, Arduino Kit, and other miscellaneous components. The complete list includes essential tools such as oscillators, function generators, power supplies, and various peripherals. The supplied items should meet industry standards to ensure compatibility and reliability in IoT projects.

Tender BOQ Items

17 Items
1.

PIC Microcontroller Kit

As per Annexure 1

Qty:1
Unit:pieces
30
2.

ARM AI Processor Kit

As per Annexure 1

Qty:2
Unit:pieces
30
3.

ARM AI Processor Kit

As per Annexure 1

Qty:2
Unit:pieces
30
4.

Raspberry Pi 5 16GB kit

As per Annexure 1

Qty:3
Unit:pieces
30
5.

Arduino Board

As per Annexure 1

Qty:3
Unit:pieces
30
6.

Arduino Board

As per Annexure 1

Qty:3
Unit:pieces
30
7.

Arduino Board

As per Annexure 1

Qty:3
Unit:pieces
30
8.

Spartan 3E Development Board

As per Annexure 1

Qty:2
Unit:pieces
30
9.

Peripherals

As per Annexure 1

Qty:1
Unit:pieces
30
10.

Peripherals

As per Annexure 1

Qty:1
Unit:pieces
30
11.

Peripherals

As per Annexure 1

Qty:1
Unit:pieces
30
12.

Oscillator

As per Annexure 1

Qty:1
Unit:pieces
30
13.

Function Generator

As per Annexure 1

Qty:1
Unit:pieces
30
14.

Power Supply

As per Annexure 1

Qty:1
Unit:pieces
30
15.

Miscellaneous Components as per requirements

As per Annexure 1

Qty:4
Unit:pieces
30
16.

Miscellaneous Components as per requirements

As per Annexure 1

Qty:4
Unit:pieces
30
17.

Miscellaneous Components as per requirements

As per Annexure 1

Qty:4
Unit:pieces
30

General Information

Item Category
PIC Microcontroller Kit , ARM AI Processor Kit , Raspberry Pi 5 16GB kit , Arduino Board , Spartan 3E Development Board , Peripherals , Oscillator , Function Generator , Power Supply , Miscellaneous Components as per requirements
Ministry Name
Ministry of Micro Small and Medium Enterprises
Department Name
Ministry of Micro Small and Medium Enterprises
Organisation Name
Development Commissioner (micro Small & Medium Enterprises)

Financial Information

Minimum Turnover
₹2.00 Lakh (s)
Bid Offer Validity
180 (Days)
Past Performance
40 %
Arbitration Clause
No
Mediation Clause
No

Evaluation and Technical Information

Evaluation Method
Total value wise evaluation
Inspection Required
Yes
Technical Clarifications Time
2 Days

Tender Documents

4 Documents
GeM-Bidding-7959853.pdfMain Document
BOQ DocumentBOQ BOQ
BOQ DocumentBOQ BOQ
GEM General Terms and Conditions DocumentGEM_GENERAL_TERMS_AND_CONDITIONS

Documents Required from Seller

  • Experience Criteria
  • Past Performance
  • Bidder Turnover
  • Certificate (Requested in ATC)
  • OEM Authorization Certificate
  • Additional Doc 1 (Requested in ATC)
  • Additional Doc 2 (Requested in ATC)
  • Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
  • the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

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Raspberry Pi 4 Model B 8 GB starter kit,RASPBERRY PI ZERO WH V2,OV5647 5MP 1080P IR Cut Camera,Rasp

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Goods
Qty:840
5 Files
Centre For Development Of Advanced Computing (c-dac)
CHENNAI, TAMIL NADU
Boq › Boql
Raspberry Pi 4 Model B 8 GB starter kit , RASPBERRY PI ZERO WH V2 , OV5647 5MP 1080P IR Cut Camera , Raspberry Pi 5 Model 8GB Starter Kit , Raspberry Pi 5 Active Cooler , BeagleBone Black REV C , BeagleBone Black Industrial AM3358 , BeagleBone AI 64 , Arduino Nano 33 IOT with Header ABX00032 , Original Arduino Nano A000005 , Arduino Nano 33 Ble Sense with Header Rev 2 ABX00070 , Arduino UNO R4 WiFi ABX00087 , Original Arduino Uno Rev3 A000066 , Original Arduino Mega 2560 ATmega2560 MCU Rev3 A000067 , Original ARDUINO Ethernet SHIELD 2 A000024 , ESP32 WROOM 32 D , ESP32 S3 DevKitC 1U-N8 Development Board , ESP32 WROOM 32E Development Kit , ESP32 CAM Development Board WiFi plus Bluetooth with OV2640 Camera Module , DS3231 , G950 01455 01 , B0506 , BO490 , NVIDIA Jetson Orin Nano Super Developer Kit , MPU 6050 3 Axis Accelerometer and Gyro Sensor , GY 271 HMC5883L 3 axis Electronic Compass Module Magnetic Field Sensor , SHT20 Sensor Module XY MD01 , Adafruit BH1750 Light Sensor STEMMA QT or Qwiic , Pycom FiPy Board , ARIES v3.0 Devlopment Board , ARIES IoT v2.0 Devlopment Board , XB24CDMSIT 001 , WRL 11812 , STM32F411RE , 37 in 1 Sensor Modules Kit , Quad Store 16in1 Sensor Modules Kit , MCP2515 Can Bus Shield Board , TJA1050 CAN Controller Bus Driver Interface Module , HF105 001 , DC Motor ROB 11696 , Micro HDMI Male to HDMI Female Adapter for Rpi 4 , High Speed Micro SD Card Reader , 50 CM USB to Micro USB Cable , 30 cm USB 2.0 A to USB 2.0 Mini B cable , 100 cm USB type C Cable compatible with Arduino , 30 cm USB A to B Cable for Arduino UNO and MEGA Boards , Pro range 5V 2.5A Power Adapter with Micro USB Plug compatible for ESP 32 board , Stepper Motor 28YBJ 48 with ULN2003 Driver Board , 4x3 Matrix 12 keys Membrane Switch Keypad , I2C or TWI or SPI Serial Interface Module , SG90 Mini Analog Servo motor , Soldering kit , Flux soldering Paste , Lead solder wire , Official Raspberry Pi 5 Camera FPC Cable 200mm , Waveshare 7inch Capacitive Touch Display for Raspberry Pi , Male to Male Jumper Wires 40Pcs 20cm , Male To Female Jumper Wires 40 Pcs 10cm , Female to Female Breadboard Jumper , 830 Points Solderless Prototype PCB Breadboard High Quality , STM32 nucleo on board programmer , Raspberry Pi Camera Module 3 , STM32F429I-DISC1 , Adafruit Feather M4 CAN Express with ATSAME51 , 4382 FEATHER STM32F405 EXPRESS , V2 link debugger , 4775 Metro ESP32 S2 Express , CJMCU 2551 MCP2551 CAN Protocol Controller High-speed Interface Module , 938 GRAPHIC DISPLAY OLED WHITE 1.3 , W25Q32 Large Capacity Flash Storage Module , ESP32 Camera Development Board WiFi plus Bluetooth Module with OV2640 Camera Module , NUCLEO WBA52CG , Reyax RYLR896 868 or 915MHz LoRa Antenna Transceiver ModuleDIP Version , CP2102 6pin USB 2.0 to TTL UART serial converter
June 11, 2025
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Frequently Asked Questions

The eligibility requirements include being a registered entity in compliance with local procurement laws. Bidders must demonstrate experience in supplying relevant electronic components. Proof of adequate financial capability and proper certifications is essential for qualification.

The technical specifications must indicate suitability for IoT applications, including compatibility with industry standards. All components, such as the PIC Microcontroller Kit and Raspberry Pi, should be operational with reliable performance metrics, ensuring they meet educational and practical requirements for projects.

Payment terms will be defined in the contract agreement, generally involving partial payments upon successful delivery and acceptance of the goods. Additionally, a performance security deposit may be required to guarantee contract fulfillment, with rates stipulated in the tender documents.

The evaluation and selection process consists of a thorough review of submitted bids focusing on both technical and financial proposals. Criteria will include adherence to specifications, competitive pricing, and previous experience with similar contracts, ensuring the best value is achieved for the Ministry.

MSEs can take advantage of specific provisions that aim to support their participation in government tenders. These include relaxed eligibility requirements and assistance during the bidding process, aligning with broader initiatives such as the ‘Make in India’ policy, promoting local sourcing and manufacturing.

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