Department of Military Affairs Tender by Indian Army (c12a356d)

HMC THK FLTR Bpass BMC 1532,HMC THK FLTR Bpass BMC 1527,Semiconductor Devices Unitized Dual N and P

Udhampur, Jammu & kashmir
Goods
Qty:15

Tender Timeline

Tender Issue
May 14, 2025 at 10:43 AM

Tender Title: BOQ BOQ BOQ

Reference Number: c12a356d

Issuing Authority/Department:
The tender is issued by the Department of Military Affairs, under the supervision of the Ministry of Defence.

Scope of Work and Objectives

The objective of this tender is to procure specific semiconductor devices and related components that include:

  • HMC THK FLTR Bpass BMC 1532
  • HMC THK FLTR Bpass BMC 1527
  • Semiconductor Devices Unitized Dual N and P IRF 7343
  • Transistor FET MRF 174
  • Transistor FET N Chan Type UF 28100V

This tender involves the sourcing of a total quantity of 15 units of the listed items, tailored for military applications and ensuring adherence to the sector's demand for quality and reliability.

Eligibility Criteria

To qualify for this tender, bidders must satisfy the following eligibility criteria:

  • The company must be a registered legal entity with sufficient capabilities to fulfill the requirements outlined in the tender document.
  • Demonstration of prior experience in dealing with semiconductor devices and related components will be an asset.
  • Compliance with all national legal standards and regulations relating to defense procurement.

Technical Requirements

Bidders are required to meet specific technical requirements for the products being tendered:

  • All semiconductor devices must meet the performance criteria specified in the tender.
  • Quality standards must align with industry benchmarks and prior procurement specifications.
  • Proven reliability and robustness of semiconductor devices must be documented.

Financial Requirements

Bidders must submit financial documentation, including proof of financial stability and the ability to engage in fulfilling a contract of this nature. Documents proving financial transactions and capability to handle the contractual obligations will be critical.

Document Submission Details

Prospective bidders must submit their proposals electronically, with the following documents included:

  • Completed bid form
  • Company registration documents
  • Financial statements
  • Technical specifications for proposed products

All documents must be submitted in accepted formats and clearly marked as required for evaluation.

Special Provisions

This tender encourages participation from Micro, Small, and Medium Enterprises (MSEs), offering benefits such as price preferences that enhance competitiveness. Provisions are also made for startups engaged in defense manufacturing.

Evaluation Process

The evaluation of bids will consider:

  • Compliance with technical specifications.
  • Financial stability and proposal pricing.
  • Historical performance and reliability of the bidder.

A systematic scoring mechanism will govern this process to ensure a fair and transparent selection of the contractor.

Delivery Locations

Successful bidders will deliver the products to specified military installations and operational centers as outlined in the final agreement, thus ensuring timely fulfillment of military needs.

Contact Information

For inquiries regarding this tender, prospective bidders are encouraged to reach out directly to the Department of Military Affairs during business hours. Please ensure to check the official website for the most accurate contact details if available.

In conclusion, this tender represents an opportunity for suppliers specializing in semiconductor devices to engage with the defense sector. With rigorous standards and comprehensive evaluation processes, the tender aims to assure quality and reliability in critical military applications.

Tender BOQ Items

5 Items
1.

HMC THK FLTR Bpass BMC 1532

Qty:2
Unit:nos
15
2.

HMC THK FLTR Bpass BMC 1527

Qty:2
Unit:nos
15
3.

Semiconductor Devices Unitized Dual N and P IRF 7343

Qty:3
Unit:nos
15
4.

Transistor FET MRF 174

Qty:6
Unit:nos
15
5.

Transistor FET N Chan Type UF 28100V

Qty:2
Unit:nos
15

General Information

Item Category
HMC THK FLTR Bpass BMC 1532 , HMC THK FLTR Bpass BMC 1527 , Semiconductor Devices Unitized Dual N and P IRF 7343 , Transistor FET MRF 174 , Transistor FET N Chan Type UF 28100V
Ministry Name
Ministry of Defence
Department Name
Department of Military Affairs
Organisation Name
Indian Army
State
Jammu & kashmir
City
Udhampur

Financial Information

OEM Average Turnover
₹1.00 Lakh (s)
Minimum Turnover
₹1.00 Lakh (s)
Bid Offer Validity
90 (Days)
Past Performance
50 %
Arbitration Clause
No
Mediation Clause
No

Evaluation and Technical Information

Evaluation Method
Total value wise evaluation
RA Qualification Rule
50% Lowest Priced Technically Qualified Bidders
Inspection Required
Yes
Technical Clarifications Time
2 Days

Tender Documents

4 Documents
GeM-Bidding-7837871.pdfMain Document
BOQ DocumentBOQ BOQ
BOQ DocumentBOQ BOQ
GEM General Terms and Conditions DocumentGEM_GENERAL_TERMS_AND_CONDITIONS

Documents Required from Seller

  • Experience Criteria
  • Past Performance
  • Bidder Turnover
  • OEM Annual Turnover
  • Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
  • the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer

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Frequently Asked Questions

The eligibility requirements include being a registered legal entity with capabilities aligning with the technical specifications outlined in the tender. Bidders should possess prior experience dealing with semiconductor devices and must comply with national regulations related to defense procurement procedures. Additional emphasis will be placed on documentation showcasing previous sales to defense entities or equivalent sectors.

The technical specifications include adherence to performance standards relevant to each semiconductor device listed in the tender. Bidders must provide detailed descriptions and certifications ensuring the reliability and robustness of devices, adhering to industry quality benchmarks suitable for military applications. Proposals must also include test results from accredited laboratories if available.

Yes, all bidders must submit an Earnest Money Deposit (EMD) as part of their bid submission. The EMD amount will be specified in the tender document and must be in the accepted formats outlined. The EMD ensures that bidders are serious and committed to fulfilling the contractual obligations if awarded.

The evaluation and selection process will review submitted proposals based on compliance with technical specifications, financial stability, and historical performance. A scoring mechanism will be employed to ensure an objective assessment. Bidders will be notified post-evaluation on the outcome of their bids as per the communicated timelines in the tender.

MSEs participating in this tender will be afforded advantages such as price preferences during the contract evaluation process. Additionally, provisions designed to promote local and indigenous manufacturing under “Make in India” policies may apply, enabling MSEs to compete effectively. Compliance with local content requirements will further enhance their proposals.

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