Interconnect sets for HPC Clusters at seven sites
S-1-IB Switch-Un-Managed,S-1-IB Switch Managed,S-1-Copper splitter cable 1.0,S-1-Copper splitter ca
Tender Timeline
Tender Title: Interconnect sets for HPC Clusters at seven sites
Reference Number: 204c82a4c
Issuing Authority/Department:
The tender is issued by the Department of Electronics and Information Technology, operating under the Ministry of Electronics and Information Technology. The department is responsible for promoting electronics and information technology developments across the nation.
Scope of Work and Objectives
This tender focuses on the procurement of interconnect sets specifically designed for High-Performance Computing (HPC) Clusters across seven designated locations. The primary aim is to ensure the efficient operation and connectivity of HPC systems by utilizing robust and reliable interconnect technologies. Through this initiative, the objective is to enhance the computing capabilities in the selected sites while adhering to stringent performance standards.
Eligibility Criteria
To qualify for participation in this tender, bidders must meet specific eligibility criteria:
- Registered entities in the relevant domain.
- Compliance with all technical and financial requirements outlined in the bid documentation.
- Demonstrated experience in successfully delivering similar products or services.
Technical Requirements
The technical specifications for the interconnect sets include various components such as:
- S-1-IB Switch-Un-Managed
- S-1-IB Switch Managed
- S-1-Copper splitter cable (across multiple sizes from 1.0 to 5.0)
- Transceivers and fiber cables (multiple variants including 10.0 optical)
- Additional managed switches (48 and 24 ports)
All components must conform to industry standards, ensuring optimal performance and compatibility with existing HPC infrastructure.
Financial Requirements
Bidders must demonstrate financial viability through:
- Provision of past financial statements.
- Ability to meet any required Earnest Money Deposit (EMD).
The EMD needs to be paid along with the technical proposal, confirming the bidder's seriousness about the tender.
Document Submission Details
Bidders are required to submit their proposals electronically. The submission must include:
- Detailed technical proposals outlining specifications and compliance with the tender requirements.
- Financial proposals that include a cost breakdown for the entire scope.
Special Provisions
This tender may include provisions for Micro, Small, and Medium Enterprises (MSEs) and startups. Such benefits can include relaxation in eligibility criteria or support in the procurement process to encourage participation from diverse suppliers.
Evaluation Process
The evaluation of bids will be conducted based on both technical and financial criteria. A two-stage evaluation process will apply where:
- Technical compliance and capability will be assessed first.
- Financial bids will be evaluated afterward for qualified technical bidders.
Delivery Locations
The interconnect sets are to be delivered to seven specific sites identified by the issuing authority as part of the HPC cluster project. Detailed locations will be provided in the tender documentation.
Contact Information
For queries related to the tender, participants can reach out to the Department of Electronics and Information Technology through official channels noted in the tender documentation.
Tender BOQ Items
134 ItemsGeneral Information
Financial Information
Evaluation and Technical Information
Tender Documents
8 DocumentsDocuments Required from Seller
- Experience Criteria
- Past Performance
- Bidder Turnover
- Certificate (Requested in ATC)
- Additional Doc 1 (Requested in ATC)
- Additional Doc 2 (Requested in ATC)
- Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
- the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
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Frequently Asked Questions
The eligibility requirements include being a registered entity in the relevant domain, showcasing previous successful deliveries of similar products, and meeting all financial and technical conditions outlined in the tender. Bidders must possess the necessary certifications to validate their operational capabilities in the electronics sector.
The technical specifications mandated for the interconnect sets include a variety of types like S-1-IB Switch-Un-Managed and S-1-IB Switch Managed, among others. Bidders must provide products that comply with industry standards to ensure seamless connectivity and performance in HPC clusters. Meeting these specifications is critical for bid acceptance.
The EMD is a mandatory prerequisite for tender participation, which must be submitted alongside the technical proposal. This financial commitment demonstrates the bidder’s intention and ability to fulfill the terms of the contract if awarded. The required amount will be specified in the tender document.
Proposals must be submitted through electronic means as specified in the tender documentation. Required documents include detailed technical and financial proposals that outline compliance with technical specifications and pricing structures.
Micro, Small, and Medium Enterprises (MSEs) may receive special considerations in the tender process. These can include relaxed eligibility criteria, assistance in the documentation process, and potential pricing advantages, thereby encouraging wider participation from smaller entities. Compliance with ‘Make in India’ policies promotes local procurement and supports national industries.
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