Department of Electronics and Information Technology Tender by Centre For Development Of Advanced Computing (c-dac) (GEM/2025/B/6116016)
Fabrication of HEATSINK LHS,Fabrication of HEATSINK RHS,Fabrication of REAR PLATE,Fabrication of BR
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Tender Title & Reference Number
Tender Title: Fabrication of HEATSINK
Reference Number: GEM/2025/B/6116016
Issuing Authority/Department
The tender is issued by the Department of Electronics and Information Technology, which operates under the Ministry of Electronics and Information Technology. This government department is committed to enhancing the electronics and information technology sector within the country.
Scope of Work and Objectives
The primary objective of this tender is the fabrication of heatsinks designed for various applications within electronic systems. The scope includes the fabrication of multiple components such as:
- HEATSINK LHS
- HEATSINK RHS
- REAR PLATE
- BRACKET FOR MIDDLE PCB
- MOUNTING PLATE
- FRONT PLATE
- TOP PLATE
- BOTTOM PLATE
- CONTROL PCB SUPPORT LHS
- CONTROL PCB SUPPORT RHS
- FAN MOUNTING BRACKET
The intended outcome is to procure high-quality fabricated components that meet strict industry standards, enhancing thermal management in electronic devices.
Eligibility Criteria
To be eligible to participate in this tender, bidders must ensure the following criteria are met:
- The bidder must be a registered entity with all valid business licenses.
- Compliance with relevant industry certifications and standards is necessary.
- Bidders must demonstrate previous experience in similar fabrication projects.
Technical Requirements
Technical specifications must adhere to the standards outlined by the Ministry of Electronics and Information Technology. The components fabricated must demonstrate:
- High thermal conductivity
- Durability and robustness
- Design compatibility with specified electronic systems
Financial Requirements
Bidders need to provide complete financial information, which includes:
- A detailed breakdown of costs associated with the fabrication process
- Information on payment terms and any additional fees
Document Submission Details
All tender documents must be submitted electronically, following the specified formats mentioned in the tender documents. It is essential that all submissions are complete, including technical bids, financial bids, and any required compliance documents.
Special Provisions
This tender contains special provisions that may benefit Micro, Small, and Medium Enterprises (MSEs) and startups. These will ensure a more inclusive participation framework and provide accessible opportunities for smaller businesses.
Evaluation Process
The evaluation of bids will be based on a set of structured criteria that includes:
- Compliance with technical specifications
- Financial competitiveness
- Previous experience and capability
All submitted bids will undergo a meticulous evaluation process to select the most competent vendor.
Delivery Locations
Delivery of the fabricated components is expected at the designated procurement locations provided by the Department of Electronics and Information Technology. Specific locations will be confirmed post-tender award.
Contact Information
For any inquiries related to the tender, participants are encouraged to reach out via the contact information available publicly on the tender portal. Always ensure to follow updated channels for queries as the information may vary.
This tender for the fabrication of heatsinks is crucial in fostering advancements in electronic systems while supporting the growth of local industries and small businesses. Bidders are encouraged to participate actively in this opportunity to contribute to the flourishing electronics sector.
General Information
Financial Information
Evaluation and Technical Information
Tender Documents
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Frequently Asked Questions
The eligibility requirements include being a registered entity, possessing valid business licenses, and demonstrating experience in similar fabrication projects. Additionally, bidders must comply with industry certifications and standards, ensuring their capacity to deliver quality heatsink fabrication.
Participants must hold relevant certificates that demonstrate compliance with industry standards. These include quality management certifications (like ISO 9001), product standard certifications, and any other documents that validate the technical competencies required for heatsink fabrication.
To register for the tender process, bidders must follow the designated registration process on the official tender portal. It generally involves submitting a registration form, providing company credentials, and ensuring your profile is up to date.
Documents must be submitted in the specified accepted document formats, generally including PDF for technical and financial bids. It’s crucial to refer to the tender documents for precise format requirements to ensure compliance.
Payment terms typically involve milestone-based payments, contingent on the satisfactory completion of fabrication and delivery. The evaluation considerations will focus on financial competitiveness, compliance with technical specifications, and prior experience in delivering similar projects.
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