Department of Electronics and Information Technology Tender by Centre For Development Of Advanced Computing (c-dac) (GEM/2025/B/6081633)
FABRICATION OF LAYER PCB
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Tender Title: Fabrication of Layer PCB
Reference Number: GEM/2025/B/6081633
Issuing Authority/Department: Department of Electronics and Information Technology, Ministry of Electronics and Information Technology
Scope of Work and Objectives
This tender is aimed at soliciting bids for the fabrication of Layer Printed Circuit Boards (PCBs). The objective is to engage qualified vendors who are capable of delivering high-quality fabrications that meet the technical and regulatory criteria set out by the department. This project will enhance the capabilities of our electronic systems and support ongoing research and development efforts.
Eligibility Criteria
To qualify for this tender, bidders must meet the following eligibility requirements:
- Be a registered business entity with a valid registration certificate.
- Demonstrate experience in the fabrication of electronic components, specifically Layer PCBs.
- Provide evidence of having successfully completed similar projects in the past.
Technical Requirements
Bidders must adhere to the following technical specifications:
- Layer count for the PCBs should be predefined.
- All manufacturing processes must comply with industry standards and quality benchmarks.
- Provide details regarding the testing protocols and quality assurance measures to ensure product integrity.
Financial Requirements
Bidders are expected to provide a detailed financial proposal that includes:
- A clear breakdown of costs associated with the fabrication of Layer PCBs.
- Any additional costs, including shipping and handling.
- An overview of payment terms, including any advance payments required.
Document Submission Details
All submissions must be made electronically through the GEM portal before the specified deadline. Required documents include:
- A duly filled bid application form.
- Relevant certificates supporting eligibility criteria.
- Financial quotations aligned with the tender specifications.
Special Provisions
This tender encourages participation from Micro, Small, and Medium Enterprises (MSEs) and startups, offering them price preferences when submitting bids. Provisions are also made in compliance with the 'Make in India' initiative, emphasizing local manufacturing.
Evaluation Process
The evaluation of bids will be conducted based on the following criteria:
- Compliance with the technical specifications outlined in the tender.
- Financial viability and cost-effectiveness of the proposal.
- Previous experience and performance in similar projects.
Delivery Locations
Delivery of the fabricated Layer PCBs will be required at specified locations as per the contractual agreement, which will be communicated to the selected bidder upon contract award.
Contact Information
For further inquiries regarding this tender, please refer to the official contact channels provided on the GEM portal as indicated.
General Information
Financial Information
Evaluation and Technical Information
Tender Documents
4 DocumentsDocuments Required from Seller
- Certificate (Requested in ATC)
- Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
- the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
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Frequently Asked Questions
The eligibility requirements include being a registered business entity, demonstrating prior experience in fabrication of electronic components, specifically Layer PCBs, and providing relevant documentation to support past performance in similar projects.
Bidders must submit several required certificates, including a valid business registration certificate, financial statements demonstrating capability, and any industry certifications pertinent to electronics manufacturing. This helps establish compliance with the required technical specifications.
The registration process involves creating an account on the GEM portal. Interested parties must complete the online registration form and provide necessary documentation to verify their capabilities. Once registered, they can proceed to submit bids for tenders such as GEM/2025/B/6081633.
The technical specifications for the Layer PCBs include details on layer count, material quality, and compliance with industry standards. Bidders are encouraged to submit details about their manufacturing processes and quality standards to ensure compliance.
Payment terms typically include provisions for advance payments and milestones based on project phases. Bidders should outline their payment structures clearly in their proposals, including any contingencies for delays or performance standards as outlined in the tender documents.
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