Tender Timeline
PCB MANUFACTURING COMPONENTS PROCUREMENT AND ASSEMBLY
Tender Reference Number: GEM/2025/B/6148856
Issuing Authority/Department: Ministry of Electronics and Information Technology, Department of Electronics and Information Technology
The PCB Manufacturing Components Procurement and Assembly tender aims to procure electronic components and assembly services essential for the development of cutting-edge technology in the electronics sector. This tender invites bids from qualified vendors who are capable of fulfilling the project requirements outlined below.
Scope of Work and Objectives
The scope of this tender includes the procurement of various PCB manufacturing components and the assembly of both Ubimote 2v3 and Ubisense 1V2 electronic devices, as specified in the detailed Bill of Quantities (BOQ). The objectives of this procurement project include ensuring high-quality components, timely delivery, and adherence to the technical specifications necessary for successful project implementation.
Eligibility Criteria
To be eligible to participate in this tender, bidders must be registered entities with experience in PCB manufacturing and assembly. Companies must possess appropriate certifications that validate their capability to meet the outlined technical requirements.
Technical Requirements
Bidders must demonstrate compliance with specific technical specifications, including quality standards stipulated by the Ministry of Electronics and Information Technology. It's important to ensure that all components are manufactured using reliable methodologies that pass established testing criteria. Detailed descriptions of the acceptable technical specifications are available in the tender documents.
Financial Requirements
Bidders are required to submit a comprehensive financial proposal, ensuring that all costs are accounted for including materials, labor, and any other expenses related to the project. Additionally, an Earnest Money Deposit (EMD) is mandatory to secure a bid, which will be annually evaluated during the financial assessment phase.
Document Submission Details
All tender submissions must be completed electronically, following the specified guidelines outlined in the tender documents. Each submission must include technical proposals, financial proposals, and required certification copies formatted as specified.
Special Provisions
This tender includes special provisions for Micro, Small, and Medium Enterprises (MSEs) and startups, encouraging their participation in the bidding process. Compliance with 'Make in India' policies is also prioritized, with an emphasis on local content and procurement rules designed to enhance domestic production.
Evaluation Process
The evaluation of bids will be based on a combination of technical and financial criteria. Each bid will be rigorously reviewed to assess capabilities and costs, ensuring a fair selection process that prioritizes quality and financial viability.
Delivery Locations
Successful bidders will be informed about delivery locations as per the requirements specified in the tender documents. Timely delivery will be crucial to meet the project timelines.
Contact Information
For clarification regarding this tender, interested vendors should refer to the official documentation and contact the Ministry of Electronics and Information Technology.
General Information
Financial Information
Evaluation and Technical Information
Tender Documents
6 DocumentsDocuments Required from Seller
- Experience Criteria
- Past Performance
- Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
- the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
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Frequently Asked Questions
The eligibility requirements include being a registered entity with relevant experience in PCB manufacturing and assembly. Bidders must provide necessary certifications that validate compliance with technical standards and quality requirements as set by the Ministry of Electronics and Information Technology.
Vendors must submit relevant certifications that demonstrate their compliance with quality and technical specifications outlined in the tender documents. These certifications typically include proof of preceding quality management systems, manufacturing capabilities, and adherence to international standards.
The Earnest Money Deposit (EMD) acts as a security against the bid submission and varies based on the total value of the tender. Specific EMD details will be specified in the tender documents, outlining necessary amounts and submission processes to ensure compliance and bid validity.
Tender submissions must be carried out electronically, adhering to specified formats in the tender documents. Required documents include technical and financial proposals, and each document must meet the stipulated submission guidelines to ensure completeness and correctness.
Yes, the tender includes provisions that benefit Micro, Small, and Medium Enterprises (MSEs) by encouraging their participation and providing support measures aimed at enhancing local production. Compliance with ‘Make in India’ initiatives will also be prioritized to support domestic manufacturers.
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