Department of Electronics and Information Technology Tender by Centre For Development Of Advanced Computing (c-dac) (GEM/2025/B/6139259)
Fabrication of 14-layer PCB
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Tender Title: Fabrication of 14-layer PCB
Reference Number: GEM/2025/B/6139259
Issuing Authority
The tender is issued by the Department of Electronics and Information Technology under the Ministry of Electronics and Information Technology.
Scope of Work and Objectives
The primary scope of this tender is for the fabrication of 14-layer printed circuit boards (PCBs), which are essential components utilized in various electronic devices. The objective is to procure high-quality PCBs that meet stringent technical specifications and quality standards. The successful bidder will be responsible for delivering 10 units of the specified PCBs, ensuring compliance with the operational requirements of the Ministry.
Eligibility Criteria
Participants must adhere to specific eligibility criteria, including being a legally registered entity capable of executing the project. All bidders are required to demonstrate prior experience in fabricating multi-layer PCBs and must possess the appropriate certifications to affirm their technical capabilities.
Technical Requirements
The technical requirements for the fabrication of the 14-layer PCBs are stringent to ensure high performance and reliability. Bidders must comply with industry-standard specifications concerning material quality, layer composition, and electrical performance, which will be detailed in the tender documentation. A clear understanding of the processes involved in PCB fabrication, as well as familiarity with modern production techniques, is vital for successful bidders.
Financial Requirements
Financial capabilities will also be assessed, ensuring that bidders can sustain long-term projects and fulfill the contract obligations. The details regarding the financial requirements, including payment terms and accepted payment methods, will be provided to qualifying bidders in the detailed tender documents.
Document Submission Details
Bidders are required to submit their proposals electronically through the designated portal. All submissions must be made before the aforementioned closing date, adhering to the specified format and requirements laid out within the tender documents.
Special Provisions
There are provisions that favor Micro, Small, and Medium Enterprises (MSEs) and startups. These businesses may benefit from certain preferential treatment to encourage participation and promote competition, which will be elaborated upon further in the tender guidelines.
Evaluation Process
A comprehensive evaluation process will be conducted to assess the proposals based on several parameters, including technical capability, experience, and financial health. Bidders should ensure their submissions reflect their competencies and understanding of the requirements, as evaluation will be meticulous and structured to ensure transparency.
Delivery Locations
The delivery of the fabricated PCBs will be directed to specified locations as indicated in the detailed documentation. Bidders should account for the logistics involved in transporting the materials efficiently.
Contact Information
For further inquiries, bidders are encouraged to refer to the official tender documentation provided by the Department of Electronics and Information Technology, where contact information may be specified for direct communication.
General Information
Financial Information
Evaluation and Technical Information
Tender Documents
3 DocumentsDocuments Required from Seller
- Compliance of BoQ specification and supporting document *In case any bidder is seeking exemption from Experience / Turnover Criteria
- the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
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Frequently Asked Questions
The eligibility requirements for participating in this tender include being a registered entity, with proven experience in the fabrication of multi-layer PCBs. Bidders must also provide necessary certifications that indicate compliance with relevant industry standards.
Bidders must submit all relevant certificates that validate their qualifications, including those pertaining to quality assurance, environmental management, and specific industry standards related to PCB fabrication. These documents ensure adherence to compliance regulations and standards.
To participate in the tender, interested bidders must register on the tendering portal, complete the required information, and ensure that all necessary documents are uploaded correctly. Detailed instructions for the registration process will be included in the tender documentation.
All required documents should be submitted in specified formats, which will typically include PDF or other universally accepted formats outlined in the tender documentation. It’s crucial to adhere precisely to these guidelines to avoid disqualification.
The payment terms will be clearly defined in the tender documentation. Typically, successful bidders may be required to adhere to milestone payments, based on the completion of specific tasks or deliverables. Full details regarding payment terms will be provided to ensure clarity and fairness.
The evaluation of proposals will take into consideration technical competency, financial health, pricing, and ability to meet delivery times. The selection is based on a thorough review process, ensuring that the most qualified bidders are chosen based on the outlined criteria.
MSEs are entitled to certain advantages that facilitate their participation, such as relaxed eligibility criteria and financial assistance provisions aimed at empowering small businesses to take part in larger projects.
This tender provides specific provisions for startups, allowing them to compete on a level playing field alongside larger, established companies. These provisions may include simplified compliance requirements and financial incentives aimed at fostering innovation and entrepreneurship.
Bidders are expected to meet comprehensive compliance requirements including environmental guidelines, quality benchmarks specific to PCB manufacturing, and local production mandates detailed in the tender. Compliance ensures that the materials and processes adhere to all regulatory standards.
Notification of results will be communicated through the tender portal, where bidders can access the outcomes post-evaluation. It’s important for bidders to monitor the portal for updates and announcements regarding their submissions.
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